In addition to the award-winning RTL8185L and RTL8255, Realtek has also successfully developed a USB 2.0-interface IEEE 802.11a/b/g dual-band triple-mode WLAN chip with integrated BBP/MAC, the RTL8187L, and an IEEE 802.11b/g Radio Frequency chip, the RTL8225. All four chips utilize the same CMOS manufacturing process, providing customers with more economic and competitive solutions for Wireless LAN applications. With the release of this series of WLAN products, Realtek ranks among the world's top three IC design houses, providing complete CMOS WLAN solutions and technologies.
"With the launch of the complete series of WLAN solutions, we are enabling a faster, more secure, and more friendly wireless network infrastructure, catalyzing needs for digital living and driving applications for the digital home", said Realtek's Executive Vice President Jessy Chen. "The new Realtek WLAN chipsets feature low power consumption, high integration, high performance, high adaptability, and compact package size, providing the most competitive WLAN total solutions for the industry".
The RTL8185L, RTL8187L, RTL8225, and RTL8255 offer a versatile combination of solutions for Wireless LAN card/module and access point/gateway/router applications.
Application strengths of the new Realtek WLAN solutions include:
(1) Asia's first all-CMOS WLAN chipsets, ranking among the world's top three all CMOS WLAN solutions, thereby increasing market opportunities and sustaining long-term competence.
(2) 7dB higher than IEEE standards; Realtek solutions achieve five times the average receive-sensibility.
(3) Fully compliant with the USB 2.0 standard, which is designed to increase data rates and restrict power use for portable devices, the new chipsets feature low power consumption, a 3dB higher output power, and 40% further distance transmission.
(4) Easy installation. Supporting Windows XP Zero Configuration and the software access point function, the Realtek WLAN solutions are able to transform a desktop computer into a wireless access point.
(5) Low manufacturing cost. In addition to no requirement for a VCO (Voltage Controlled Oscillator) or a SAW (Surface Acoustic Wave), implementation of the new chipsets can cut 20% of external components and 33% of bonding pins, greatly reducing manufacturing cost.
Samples for the RTL8185L, RTL8187L, RTL8225, and RTL8255 are available now. Mass production is scheduled for August 2004. The new series will be showcased at Realtek's Computex booth, No. D210, Hall 1, Taipei World Trade Center, June 1~5.